发明名称 |
SANDWICH STRUCTURE WITH DOUBLE-SIDED COOLING AND EMI SHIELDING |
摘要 |
A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current.
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申请公布号 |
US2011205709(A1) |
申请公布日期 |
2011.08.25 |
申请号 |
US20100712058 |
申请日期 |
2010.02.24 |
申请人 |
YIN JIAN;JIANG HUNT H;YAO KAIWEI |
发明人 |
YIN JIAN;JIANG HUNT H.;YAO KAIWEI |
分类号 |
H05K7/20;B23P15/26 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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