| 摘要 |
A method is disclosed which includes applying a surface treatment to a substrate to form a patterned area having at least some electrical conductivity; electroplating onto the patterned area with a tool having a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between the patterned area and the first electrode, thereby to deposit conductive material onto the patterned area.
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