发明名称 |
SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad. |
申请公布号 |
US2011204516(A1) |
申请公布日期 |
2011.08.25 |
申请号 |
US20100711712 |
申请日期 |
2010.02.24 |
申请人 |
INPAQ TECHNOLOGY CO., LTD. |
发明人 |
WU LIANG-CHIEH;WANG CHENG-YI |
分类号 |
H01L23/498;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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