| 发明名称 |
THERMOSETTING DIE-BONDING FILM, DICING DIE-BONDING FILM, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting die-bonding film which limits warpage of an object to be bonded by thermosetting. <P>SOLUTION: The thermosetting die-bonding film 3 used for bonding a semiconductor chip to an object to be bonded has an integrated value of tensile storage elastic modulus of 1-50 GPa, in the range of temperature of 25-120°C, after carrying out thermosetting on conditions of 1 hour at 120°C. The thermosetting die-bonding film 3 contains epoxy resin and/or phenol resin as the thermosetting resin, and contains acrylic resin as the thermoplastic resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011165716(A) |
申请公布日期 |
2011.08.25 |
| 申请号 |
JP20100023420 |
申请日期 |
2010.02.04 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
SHISHIDO YUICHIRO;KIMURA TAKEHIRO;TAKAMOTO HISAHIDE |
| 分类号 |
H01L21/52;C09J7/00;C09J7/02;C09J133/04;C09J161/06;C09J163/00;H01L21/301 |
主分类号 |
H01L21/52 |
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