COMPOSITION FOR PRINTING A SEED LAYER AND PROCESS FOR PRODUCING CONDUCTOR TRACKS

摘要

A composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate is provided. The composition comprises 0.1 to 6% by weight of electrolessly and/or electrolytically coatable particles, 40-98.8% by weight of at least one solvent, 0 to 15% by weight of a crosslinker, 0.1 to 6% by weight of at least one dispersing additive, 0 to 5% by weight of at least one further additive and 1 to 20% by weight of at least one polymer, said at least one polymer being in the form of a dispersion. A process for producing full-area or structured metallic surfaces on a substrate is provided. A use of the process is also provided.