| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excelling in surface flatness, resolution and via shape, and to provide a photosensitive element serving as a dry film type photosensitive solder resist. <P>SOLUTION: The photosensitive resin composition includees (a) an acid-modified vinyl group-containing epoxy resin; (b) a photopolymerizable monomer having an ethylenically unsaturated group; (c) a photopolymerization initiator; (d) a heat-curing agent; and (f) at least one polyphenol represented by general formula (I) and having two or more OH groups as substituents on the benzene ring, wherein Z denotes a halogen atom, a hydrogen atom, 1-20C alkyl, 3-10C cycloalkyl, amino, aryl which may be substituted by 1-20C alkyl, monoalkylamino or dialkylamino which is substituted by 1-20C alkyl, mercapto, 1-10C alkylmercapto, carboxyalkyl whose alkyl is 1-10C alkyl, 1-20C alkoxy or a group comprising a heterocycle; m<SB>1</SB>is an integer of 2 to 6 and m<SB>2</SB>is 0 or an integer of 1 to 4, so that m<SB>1</SB>+m<SB>2</SB>equals 2 to 6, and when m<SB>2</SB>is an integer of ≥2, two or more symbols Z may be the same or different. <P>COPYRIGHT: (C)2011,JPO&INPIT |
