| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a radiation detection module having improved assembly properties. <P>SOLUTION: The radiation detection module includes: a radiation detection substrate to which a plurality of semiconductor elements are mounted; a fixing member for holding the radiation detection substrate; and a circuit board connected to the radiation detection substrate. The radiation detection substrate includes: a substrate including an edge portion at one end; a plurality of semiconductor elements connected to the substrate; and a flexible board including a wiring pattern connected to each of the plurality of semiconductor elements. The fixing member includes a bottom, a first side face, and a second side face, and includes a substrate support portion provided on the first and second side faces and supporting the radiation detection substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
