发明名称 ELECTRONIC COMPONENT MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic components manufacturing device capable of automatically and continuously producing electronic components with lead wire by using the existing long metal wire without using an exclusive jig and special molding and working of lead wire. SOLUTION: The device includes a metal wire conveyance mechanism for arranging a pair of metal wire 3 to be a pair of lead wires at a first interval d1 set to be the width or below of both edges of component body 2 in parallel and simultaneously conveying them an extending direction, a line pitch variation mechanism 5 for partially expanding the interval of a pair of metal wire 3 to a second interval d2 wider than the first interval d1, and turning the interval from the second interval d2 to the first interval d1, a component body installing mechanism for installing a component body 2 between a pair of metal wire 3 at the second interval d2 so that an electrode 2a is opposed to the metal wire 3, a metal wire holding mechanism for connecting the metal wire set to the first interval d1 by the line pitch variation mechanism in a state with the component body installed therein to an electrode of the component body with electrically conductive welding material, and a wire cutting mechanism for cutting the metal wire to a predetermined length. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011165984(A) 申请公布日期 2011.08.25
申请号 JP20100028233 申请日期 2010.02.10
申请人 MITSUBISHI MATERIALS CORP 发明人 SATO TATSUYA;MATSUMARU HIROYUKI
分类号 H01C7/04;H01C17/28;H01G4/228;H01G13/00 主分类号 H01C7/04
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