| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which heat dissipation can be improved and restrictions on design can be eased. SOLUTION: The wiring board includes: a circuit board 11 where a wiring pattern is formed; and a heat radiation layer 20 having a first insulating layer 3 formed of insulation resin, a second insulating layer 8 formed of insulation resin, and a conductive graphite sheet 2 sandwiched between the first insulating layer 3 and the second insulating layer 8, on the side where the wiring pattern of the circuit board 11 is formed. The heat radiation layer 20 includes: a conducting section 4 formed by a conductive material, which penetrates the first insulating layer 3, the graphite sheet 2 and the second insulating layer 8 and is electrically connected to the whole or a part of the wiring pattern; and an insulating section 5 formed by insulation resin to insulate the graphite sheet 2 from the conducting section 4. COPYRIGHT: (C)2011,JPO&INPIT |
