| 摘要 |
Embodiments provide a wiring substrate that allows a wire to be released from an insulating material after use, a method for manufacturing the wiring substrate, and a method for disassembling the wiring substrate. A wiring substrate includes a release layer formed between an insulating material and a wire. The release layer is configured to reduce an a strength of adhesion between the wire and the insulating layer when disassembling or recycling the wiring substrate.
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