发明名称 |
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTION BETWEEN TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide: a conductive connection sheet that reduces generation of a leakage current between adjacent terminals due to a failure in making a metal material in a fused state cohere selectively on a terminal; a method for connection between terminals using the conductive connection sheet; a method for forming a connection terminal; a semiconductor device with high reliability; and an electronic apparatus. SOLUTION: The conductive connection sheet 1 comprises a laminate including resin composition layers 11, 13 and a metal layer 12, and is characterized in that a content of a compound having a flux function contained in the first resin composition layer 11 is higher than that contained in the second resin composition layer 13. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011166093(A) |
申请公布日期 |
2011.08.25 |
申请号 |
JP20100030730 |
申请日期 |
2010.02.15 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
CHUMA TOSHIAKI;KAGIMOTO TOMOHIRO |
分类号 |
H01L21/60;H01B5/02;H01R11/01 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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