发明名称 CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTION BETWEEN TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide: a conductive connection sheet that reduces generation of a leakage current between adjacent terminals due to a failure in making a metal material in a fused state cohere selectively on a terminal; a method for connection between terminals using the conductive connection sheet; a method for forming a connection terminal; a semiconductor device with high reliability; and an electronic apparatus. SOLUTION: The conductive connection sheet 1 comprises a laminate including resin composition layers 11, 13 and a metal layer 12, and is characterized in that a content of a compound having a flux function contained in the first resin composition layer 11 is higher than that contained in the second resin composition layer 13. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011166093(A) 申请公布日期 2011.08.25
申请号 JP20100030730 申请日期 2010.02.15
申请人 SUMITOMO BAKELITE CO LTD 发明人 CHUMA TOSHIAKI;KAGIMOTO TOMOHIRO
分类号 H01L21/60;H01B5/02;H01R11/01 主分类号 H01L21/60
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