COMPONENT-EMBEDDED SUBSTRATE

摘要

Disclosed is a component-embedded substrate through which wiring can be easily run by simply forming vias, without changing laser processing conditions for each via, without needing longer (deeper) vias, and without needing a separate process such as a build-up process. Furthermore, the diameters of the vias can be kept small. Wiring blocks (5A and 5B) and a component (3) are embedded in a component-embedded layer (4), and conductive layers are formed over the entire surfaces of the wiring blocks (5A and 5B). The wiring blocks (5A and 5B) and the component (3) are arranged such that the conductive layers on the bottom surfaces of the wiring blocks (5A and 5B) and electrodes (3A) on the component (3) are in contact with a bottom-surface wiring layer (6B). Via conductors (7) are formed above the conductive layers on the top surfaces of the wiring blocks (5A and 5B) and the electrodes (3A) on the component (3). Said via conductors (7) electrically connect a wiring layer (6A) on the top surface of the component-embedded layer (4) with the conductive layers on the top surfaces of the wiring blocks (5A and 5B) and the electrodes (3A) on the component (3).