HIGH FREQUENCY MODULE MANUFACTURING METHOD

摘要

A resin substrate whereon an electronic component is mounted is placed so that the electronic component faces a resin tank. Resin in a non-flowing state within the resin tank is softened until becoming capable of flowing, and air in the space formed between the resin substrate and the resin is absorbed. The resin substrate is brought into contact with the liquid surface of the resin. Pressure is applied to the resin, and the resin is made to flow in-between the resin substrate and the electronic component. The resin is hardened, forming a resin section on the surface of the resin substrate. A shielding metallic film is formed on the surface of the resin section. Thus, a high frequency module can be obtained which has little internal stress within the resin section, and has little circuit-characteristic variation.