SEMICONDUCTOR BLOCK BONDING APPARATUS, SEMICONDUCTOR BLOCK BONDING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

Disclosed is a semiconductor block bonding apparatus which is provided with: a carry in/out section (2) that carries in and carries out a semiconductor block (8) and a base substrate (7); a supporting section that is provided with a suction pad (32), which sucks the surface of the semiconductor block (8), an actuator (33), which is connected to the suction pad (32), and which vertically moves, by means of air pressure, the semiconductor block (8) sucked by the suction pad (32), and an air apparatus (34), which is connected to the actuator; an applying section (4), which applies an adhesive containing a polymerizable vinyl monomer to a base substrate (7); a stage (13), which has the semiconductor block (8) or the base substrate (7) placed thereon, and which moves among the carry in/out section (2), the supporting section (3) and the applying section (4); and a control apparatus (5) that controls a step wherein the base substrate (7) is transferred from the carry in/out section (2) to the applying section (4), the base substrate (7) having the adhesive applied thereto is transferred to below the semiconductor block (8) immediately after the adhesive is applied to the base substrate (7) by the applying section (4), and the semiconductor block (8) is brought down and bonded to the base substrate (7).