| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably fix a plurality of semiconductor modules to a plurality of heat sinks. <P>SOLUTION: An inverter apparatus 1 includes six semiconductor devices 27. Each semiconductor device 27 includes a semiconductor module 22, and a pair of heat sinks 24 attached onto both surfaces. Elastic members 26 are disposed between two adjacent heat sinks 24 and between the heat sink 24 and a case 10. The elastic members 26 are elastically deformed in a compression direction. A plurality of semiconductor modules 22 and a plurality of heat sinks 24 are elastically supported inside the case 10 by the elastic members 26. The elastic member 26 includes a rib plate 26e inserted between fins 24b in the heat sink 24. The elastic member 26 adjusts an effective surface area and a passage cross-sectional area of the heat sink 24. <P>COPYRIGHT: (C)2011,JPO&INPIT |
