| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element, a method of manufacturing the light emitting element, and a light emitting package. <P>SOLUTION: The light emitting element includes: a light emitting structure including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer; a phosphor layer on the light emitting structure; and a light extraction structure formed on the phosphor layer. The light extraction structure can extract light that is generated inside the light emitting structure and impinges on an interface between the phosphor layer and the light extraction structure to the outside of the light emitting structure. <P>COPYRIGHT: (C)2011,JPO&INPIT |
