| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a bump is arranged on a semiconductor substrate via a bump electrode and which controls the lowering of reliability irrespective of the mounting time and the used environment. <P>SOLUTION: On a surface-protective film 5 arranged on a pad electrode 3, a slit 5b is formed, which is located on the pad electrode 3, has a frame-shape surrounding the periphery of a bump electrode 6, and reaches the pad electrode 3 from the surface opposite to the semiconductor substrate 1 side of the surface-protective film 5. In such a semiconductor device, even when a crack occurs in a part contacting the bump electrode 6 of the surface-protective film 5, the extension of this crack is stopped by the slit 5b, so that the crack is prevented from extending beyond the pad electrode 3. Water and the like is prevented, therefore, from going inside the semiconductor device, so that the lowering of the reliability of the semiconductor device is prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
