| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique advantageous for miniaturizing a solid-state image pickup device. <P>SOLUTION: This production method of a solid-state image pickup device includes: a first process for fixing a second face of a solid-state image pickup element having a first face and a second face and having a pixel region and an electrode pad disposed in the outer side of the pixel region in the first face to a mounting member having a terminal; a second process for connecting the electrode pad with the terminal through a conductive member; a third process for placing a cover member on the first face of the solid-state image pickup element; and a fourth process for applying an adhesive along the outer side edge of the cover member and curing the adhesive to fix the cover member to the solid-state image pickup element. The first process, the second process, the third process, and the fourth process are performed in this order. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
