FOIL AND METHOD FOR FOIL-BASED CLIP-AND/OR WIRE-BONDING AND RESULTING PACKAGE

摘要

The present invention relates to a package (1) in which a semiconductor device is bonded by foil-based bonding, in particular by foil-based clip- and/or wire-bonding of, comprising a die (2) attached to a first carrier (4) with its first side (6), and attached with its second side (8) to a second carrier (9, 9a, 10), the second carrier comprising a foil (9, 9a, 10) for foil-based bonding, in particular for foil-based clip- and/or wire-bonding of a semiconductor device, and the first (4) and second (9, 9a, 10) carrier are mutually connected, such that a thermal and/or electrical current may flow from the second side (8) of the die (2) to any pad (11) in the first carrier (4), whereas the die (2) and the first (4) and the second (9, 9a, 10) carrier are encapsulated at least partially, characterized in that the foil (9, 9a, 10) is a foil (9, 9a, 10) for foil-based bonding, in particular for foil-based clip- and/or wire-bonding of a semiconductor device, comprising an insulating material (9a) containing at least one conductive structure (10), whereas the conductive structure (10) comprises at least three sections (10a, 10b, 10c, 10d) with mutually different spatial orientations.