| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device package having a novel and simple structure and the reduced size, a method of manufacturing the light-emitting device package, and an illumination system. <P>SOLUTION: The light-emitting device package includes: a semiconductor layer of a first conductivity type; an active layer partially formed under the semiconductor layer of the first conductivity type; a light-emitting structural layer containing a semiconductor layer of a second conductivity type under the active layer; an insulating layer partially disposed on the sides of the active layer and the semiconductor layer of the second conductivity type and under the semiconductor layer of the second conductivity type; an electrode that is disposed under the semiconductor layer of the first conductivity type and is electrically isolated from the active layer and the semiconductor layer of the second conductivity type by the insulating layer; a first conduction region that is disposed under the semiconductor layer of the second conductivity type, the insulating layer, and the electrode and is electrically connected to the electrode; a second conduction region that is electrically connected to the semiconductor layer of the second conductivity type; and a metal support layer containing an insulating region that is disposed between the first conduction region and the second conduction region to electrically isolate the first conduction region and the second conduction region. <P>COPYRIGHT: (C)2011,JPO&INPIT |
