| 摘要 |
PROBLEM TO BE SOLVED: To provide an evaluation method and an evaluation device stably and correctly evaluating impact strength of a semiconductor wafer relative to conventional ones. SOLUTION: This evaluation device of a semiconductor wafer includes at least a mounting base for mounting a sample being a semiconductor wafer thereon, a one-side holding unit to support one-side main surface of the sample; a spherical object; and a dropping unit to drop the spherical object from an optional desired height, wherein the sample is mounted on the mounting base, and thereafter the spherical object can be dropped, by the dropping unit, toward the main surface from the desired height in the state where the one-side main surface of the sample is supported by the one-side holding unit. COPYRIGHT: (C)2011,JPO&INPIT |
