EPOXY RESIN COMPOSITION FOR FILM ADHESIVE

摘要

PURPOSE: An epoxy resin composition for film adhesives is provided to ensure excellent adhesive strength and impact resistance at low temperature (zero 100-180 °C) as well as room temperature(25 °C) and to manufacture an insulating panel of a LNG storage tank. CONSTITUTION: An epoxy resin composition for film adhesives comprises: 100 parts by weight of an epoxy resin including two or more glycidyl groups within molecules; 5-50 parts by weight of a reactive rubber including carboxylic acids at the end thereof; 1-20 parts by weight of dicyandiamide hardener; 0.1-10 parts by weight of urea-based curing accelerator; and 0.1-5 parts by weight of modified curing accelerator. The viscosity at 70 °C is 3,000-100,000 cps and the curing time at 80 °C is within 5 hours.