| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a sapphire substrate to efficiently finish into surface roughness of not more than 0.01μm. SOLUTION: The method for processing a sapphire substrate, on which an optical device layer is to be formed, includes: a first grinding step of holding a sapphire substrate cut out from a sapphire ingot, in one face side of the substrate on a chuck table of a grinding device and grinding the other face of the substrate to remove a wavy state of the other surface of the substrate; a second grinding step of holding the other face side of the sapphire substrate after the first grinding step on the chuck table of the grinding device and grinding the one surface of the substrate to remove a wavy state of the one surface; and a surface polishing step of holding one or the other face as a back face of the sapphire substrate after the second grinding step on a chuck table of a polishing device, and dry-polishing the surface of the sapphire substrate with a polishing pad comprising silica particles fixed with a rubber material to finish into a surface roughness of not more than 0.01μm. COPYRIGHT: (C)2011,JPO&INPIT |
