| 摘要 |
PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for high temperature use, which has strength required for bonding of an electronic component and a substrate. SOLUTION: The Pb-free solder alloy contains: Bi, which is the first element, as the main ingredient;≥0.4 mass% and≤13.5 mass% Zn, which is the second element; and≥0.01 mass% and≤1.5 mass% Sn, which is the third element; does not contain Ag; and further contains:≤2.5 mass% Al and≤0.5 mass% P. The Pb-free solder alloy may further contain≥0.02 mass% Al, or≥0.001 mass% P, or both of them. COPYRIGHT: (C)2011,JPO&INPIT |
