发明名称 |
Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof |
摘要 |
A device includes a semiconductor chip having contact pads arranged on a first main face of the semiconductor chip. A first material has an elongation to break of greater than 35% covering the first main face of the semiconductor chip. An encapsulation body covers the semiconductor chip. A metal layer is electrically coupled to the contact pads of the semiconductor chip and extends over the encapsulation body.
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申请公布号 |
US2011204513(A1) |
申请公布日期 |
2011.08.25 |
申请号 |
US20100712889 |
申请日期 |
2010.02.25 |
申请人 |
MEYER THORSTEN;HEITZER LUDWIG;MAIER DOMINIC |
发明人 |
MEYER THORSTEN;HEITZER LUDWIG;MAIER DOMINIC |
分类号 |
H01L23/498;H01L21/78 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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