| 摘要 |
A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.
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