| 摘要 |
A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.
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