A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).
申请公布号
EP2310205(A4)
申请公布日期
2011.08.24
申请号
EP20080781582
申请日期
2008.07.09
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
BHOWMIK, SIDDHARTHA;KOMMERA, SWAROOP K.;GIRI, MANISH;BROWNING, ROBERT N.K.;SCHMIDT, CHARLES GUSTAV