发明名称 |
METHOD AND APPARATUS FOR MOUNTING COMPONENT |
摘要 |
PURPOSE: A part mounting device and a method thereof are provided to properly adjust a part mounting location according to printing tolerance, thereby preventing defective soldering. CONSTITUTION: A printing device(10) prints soldering on a board electrode. A print inspecting device(20) calculates printing tolerance by inspecting a printed board. A mounter(30) mounts parts on a board with printed soldering. A reflow furnace(40) reflows the board on which parts are mounted. A head unit mounts the parts on the board.
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申请公布号 |
KR20110095124(A) |
申请公布日期 |
2011.08.24 |
申请号 |
KR20100137834 |
申请日期 |
2010.12.29 |
申请人 |
YAMAHA HATSUDOKI KABUSHIKI KAISHA |
发明人 |
NAKAGAWA YOSHIYUKI;MIYAKE YASUSHI |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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