发明名称 METHOD AND APPARATUS FOR MOUNTING COMPONENT
摘要 PURPOSE: A part mounting device and a method thereof are provided to properly adjust a part mounting location according to printing tolerance, thereby preventing defective soldering. CONSTITUTION: A printing device(10) prints soldering on a board electrode. A print inspecting device(20) calculates printing tolerance by inspecting a printed board. A mounter(30) mounts parts on a board with printed soldering. A reflow furnace(40) reflows the board on which parts are mounted. A head unit mounts the parts on the board.
申请公布号 KR20110095124(A) 申请公布日期 2011.08.24
申请号 KR20100137834 申请日期 2010.12.29
申请人 YAMAHA HATSUDOKI KABUSHIKI KAISHA 发明人 NAKAGAWA YOSHIYUKI;MIYAKE YASUSHI
分类号 H05K13/04 主分类号 H05K13/04
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