发明名称 BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE
摘要 A first light-blocking member (10) and a second light-blocking member (30) are adhered to each other by forming a light-transmitting layer having a light-transmitting composition (21) serving as a base material and a light-transmitting filler (22) different in index of refraction from this light-transmitting composition (21) on a front surface of the first light-blocking member (10), applying a liquid light curing adhesive to a front surface (20a) of the light-transmitting layer (20), arranging the second light-blocking member (30) on the front surface (20a) of the light-transmitting layer (20) to which the liquid light curing adhesive has been applied, curing the liquid light curing adhesive by irradiating the light-transmitting layer (20) with light having a prescribed wavelength laterally from a side of the light-transmitting layer (20) so as to adhere the light-transmitting layer (20) and the second light-blocking member (30) to each other. By doing so, in adhering the light-blocking members to each other by using a light curing adhesive, an adhesion operation can easily and quickly be performed while ensuring sufficient adhesion strength.
申请公布号 EP2360218(A1) 申请公布日期 2011.08.24
申请号 EP20090820586 申请日期 2009.10.14
申请人 OMRON CORPORATION 发明人 USHIRO, YUKI;KAMEDA, TAKAMASA;KOMAI, KAZUNARI;MIYATA, TSUYOSHI;OKUNO, MOTOHARU;KASUYA, MAKOTO
分类号 C09J5/00;B32B7/00;B32B7/02;B32B7/04;B32B7/12;G02B6/122;G02B6/42;H01L23/29;H01L23/31;H01L31/02;H01L33/00 主分类号 C09J5/00
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