| 摘要 |
A plurality of electronic components 1 and 2 including at least one heat-generating electronic component 1 and constituting an electronic circuit are spaced from each other on a circuit board 4. Regions of one or both sides of the circuit board 4, including regions around the plurality of electronic components 1 and 2, are covered with a heat-dissipating member 3. A surface of the heat-dissipating member 3 facing the circuit board 4 has irregularities. An end surface of a protrusion 5 in the facing surface of the heat-dissipating member 3 is in contact with a circuit board surface between the electronic components 1 and 2, directly or with a heat-dissipating sheet 7 interposed therebetween. A wall surface of a recess 6 in the facing surface of the heat-dissipating member 3 is in surface-contact with the heat-generating electronic component 1 within the recess 6, directly or with the heat-dissipating sheet 7 interposed therebetween. Thus, heat from the heat-generating electronic component 1 and heat from the circuit board 4 heated by the heat from the heat-generating electronic component 1 are dissipated outside through the heat-dissipating member 3. |
