| 摘要 |
Problem to be Solved The present invention has an object to substantially eliminate the need for or significantly reduce disassembling and selecting operations of an electronic device into components. Solution The present invention provides a crushed object of an electronic device that is obtained by crushing waste including an electronic device using a mill, including: crushed particles having a particle size less than a predetermined size; and crushed pieces having a size equal to or more than the predetermined size, wherein a TMR index of the crushed particle is twice or more a TMR index of the waste. In the crushed object of an electronic device, among the crushed pieces, 90% or more of all the crushed pieces have a size twice or more the predetermined size. In the crushed object of an electronic device, among the crushed pieces, 70% or more of all the crushed pieces have a size four times or more the predetermined size. In the crushed object of an electronic device, the predetermined size is 1 mm. The present invention also provides a selected and recovered object that is obtained by selecting, according to sizes, a crushed object obtained by crushing an electronic device using a mill, wherein the selected and recovered object is obtained by selecting and recovering crushed particles having a size equal to or less than a predetermined size from a crushed object of an electronic device according to any of the above.
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