发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a lead frame which never causes a position shift due to inclination of a lead and improves wire bonding quality and adhesive strength of die attaching. <P>SOLUTION: The lead frame 200 includes a plurality of leads 210, a branch piece 220, and a coupling bar 230, wherein the leads 210 is formed on a first plane 201 and the branch piece 220 is formed on a second plane 202, so that the branch piece 220 is lower, and a coupling bar 230 is formed between the first plane 201 and second plane 202. The coupling bar 230 has at least two or more folds, for example, a first fold 231A and a second fold 231B, and elastically couples the branch piece 220 and a circumferential lead 211. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP4755214(B2) 申请公布日期 2011.08.24
申请号 JP20080041506 申请日期 2008.02.22
申请人 发明人
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
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