| 摘要 |
PURPOSE: An epoxy resin composition is provided to prevent the separation from a semiconductor device or a substrate, to ensure high reliability under vacuum, and to enable use as under-fill materials. CONSTITUTION: An epoxy resin composition comprises (A) 100 parts by mass of an epoxy resin, (B) an amine-based curing agent in the amount that the molar amount of the group having reactivity with an epoxy group in (B) component to the molar amount of the epoxy group in (A) component is 0.7~1.2, (C) 50~300 parts by mass of inorganic filler with the average particle diameter of 0.1~2 micron and the maximum particle diameter of 24 micron or less, and (D) 1~20 parts by mass of silicon particles formed by coating a polyorganosilsesquioxane resin on silicone rubber spheres, wherein the silicon particles have the average particle diameter of 0.1~10 micron and the maximum particle diameter of 24micron or less.
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