| 发明名称 |
Method of fabrication an integrated circuit |
| 摘要 |
A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
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| 申请公布号 |
US8003529(B2) |
申请公布日期 |
2011.08.23 |
| 申请号 |
US20100693405 |
申请日期 |
2010.01.25 |
| 申请人 |
GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
LIM SUH FEI;CHEW KOK WAI;CHU SANFORD SHAO-FU;CHENG MICHAEL CHYE HUAT |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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