发明名称 |
Heat-conductive dielectric polymer material and heat dissipation substrate containing the same |
摘要 |
A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.
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申请公布号 |
US8003216(B2) |
申请公布日期 |
2011.08.23 |
申请号 |
US20070699710 |
申请日期 |
2007.01.30 |
申请人 |
POLYTRONICS TECHNOLOGY CORPORATION |
发明人 |
WANG DAVID SHAU CHEW;YANG EN TIEN;YU JYH MING;CHU FU HUA |
分类号 |
B32B15/092;B32B27/20;B32B27/38;C08K3/14;C08K3/20;C08K3/22;C08K3/28;C08K3/34;C08K3/38;C08L63/00 |
主分类号 |
B32B15/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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