| 摘要 |
A wire-free chip module and method. The wire-free chip module including a conductive pattern formed from at least a portion of a lead frame, the conductive pattern including a plurality of pads; at least two electrical components that includes an integrated circuit and a passive component, the integrated circuit and the passive component bonded to the plurality of pads by solder; and wherein the conductive pattern is disposed to interconnect at least a portion of the integrated circuit with the passive component.
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