LED chip package structure using a substrate as a lampshade and method for making the same

摘要

An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.