发明名称 Memory cell formation using ion implant isolated conductive metal oxide
摘要 Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnOX, LaSrCoOX, LaNiOX, etc.) over the bottom electrode. At least one portion of the layer of CMO is configured to act as a memory element without etching, and performing ion implantation on portions of the layer(s) of CMO to create insulating metal oxide (IMO) regions in the layer(s) of CMO. The IMO regions are positioned adjacent to electrically conductive CMO regions in the unetched layer(s) of CMO and the electrically conductive CMO regions are disposed above and in contact with the bottom electrode and form memory elements operative to store non-volatile data as a plurality of conductivity profiles (e.g., resistive states indicative of stored data).
申请公布号 US8003511(B2) 申请公布日期 2011.08.23
申请号 US20090653851 申请日期 2009.12.18
申请人 UNITY SEMICONDUCTOR CORPORATION 发明人 RINERSON DARRELL;BORNSTEIN JONATHAN;CHEUNG ROBIN;HANSEN DAVID;LONGCOR STEVEN W.;MEYER RENE;SCHLOSS LAWRENCE
分类号 H01L21/44 主分类号 H01L21/44
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