发明名称 Stack module, card including the stack module, and system including the stack module
摘要 Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First selection lines are electrically connected to selection terminals of first unit substrates disposed in odd-number layers, pass through some of the unit substrates, and extend to a lowermost substrate of the unit substrates. Second selection lines are electrically connected to selection terminals of second unit substrates disposed in even-number layers, pass through some of the unit substrates, and extend to the lowermost substrate of the unit substrates. The selection terminal is disposed between the first selection lines and the second selection lines.
申请公布号 US8004848(B2) 申请公布日期 2011.08.23
申请号 US20080126313 申请日期 2008.05.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAEK SEUNG-DUK;UMEMOTO MITSUO;LEE KANG-WOOK
分类号 H01L23/02 主分类号 H01L23/02
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