发明名称 |
Manufacturing method of semiconductor device |
摘要 |
A manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhesive film is adhered on the circuit surface of the wafer; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer; picking up individual chips together with the adhesive film; die-bonding said individual chip to predetermined position of a chip mounting substrate via said adhesive film; fixing the chip to the chip mounting substrate by heating the die-bonded chip having the adhesive film; and applying a static pressure larger than an ambient pressure by 0.05 MPa or more to a stacked body including the adhesive film one or more times, at any point between adhering the wafer to the adhesive film and fixing the chip to the chip mounting substrate.
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申请公布号 |
US8003441(B2) |
申请公布日期 |
2011.08.23 |
申请号 |
US20080670127 |
申请日期 |
2008.07.18 |
申请人 |
LINTEC CORPORATION |
发明人 |
MAEDA JUN;TANAKA KEIKO;YAMAZAKI OSAMU |
分类号 |
H01L21/301;H01L21/304;H01L21/58;H01L21/60 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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