发明名称 |
METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE |
摘要 |
<p>A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W/mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member.</p> |
申请公布号 |
KR20110094297(A) |
申请公布日期 |
2011.08.23 |
申请号 |
KR20117012567 |
申请日期 |
2008.11.25 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
SUZUKI MOTOHIRO;YONEMURA NAOMI;OKAJIMA YOSHIHIKO;MAEDA TETSURO;YOSHIMURA EIJI |
分类号 |
H01L33/48;H01L33/02 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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