发明名称 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.</p> |
申请公布号 |
HK1135556(A1) |
申请公布日期 |
2011.08.19 |
申请号 |
HK20100102067 |
申请日期 |
2010.02.26 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS INC. |
发明人 |
OKA, YOSHIO;PARK, JINJOO;MAEDA, KAZUYUKI;YAGI, NARITO;SHIMOMURA, TETSUYA;NISHIKAWA, JUNICHIRO |
分类号 |
G11B;H05K |
主分类号 |
G11B |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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