| 摘要 |
PROBLEM TO BE SOLVED: To provide a means of stabilizing electric connections of a circuit board, an electronic component mounted on a wiring pattern provided in a surface layer of the circuit board, an insulating resin sealing them, and a metal film provided on the insulating resin and constituting a shield. SOLUTION: A module 101 includes: a substrate portion 103; the electronic component 104; a mold portion 102 sealing them; a shield portion 112 which covers upward inner layer wiring 107 exposed in a cross-section thereof while having a first shear droop portion 110, downward inner layer wiring 109 exposed while having a second shear droop portion, and a surface of the mold portion 102 and which is composed of a metal film formed by sputtering; and a resin portion 118 covering more than a part of the shield portion 112, the module 101 has enhanced reliability by covering grooves 116 formed on side faces of the substrate portion 103 with the resin portion 118. COPYRIGHT: (C)2011,JPO&INPIT |
