| 摘要 |
<p>Disclosed is a technique for carrying out electroless nickel plating, electroless palladium plating and electroless gold plating on a high density copper wiring pattern, which is formed by a semi-additive method, without forming bridges on a base resin. Specifically disclosed is a method for producing a printed wiring board, which is characterized in that: a printed wiring substrate that is provided with a copper wiring pattern by a semi-additive method is processed with a catalyst removal liquid that contains nitric acid, chlorine ions and a cationic polymer; then the resulting printed wiring substrate is processed with a bridge prevention liquid that contains a sulfur-containing organic material; and after that electroless nickel plating, electroless palladium plating and electroless gold plating are carried out thereon.</p> |
