SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package module including a self assembled insulation thin film and a manufacturing method thereof are provided to improve degree of freedom in a PCB design process by simultaneously forming an insulation thin film with uniform thickness in a plurality of via holes. CONSTITUTION: A module printed circuit board(120) includes a plurality of circuit wiring layers(121-126). A plurality of metal wiring patterns(130) is respectively formed in the plurality of circuit wiring layers. The metal wiring pattern includes an internal metal wiring pattern(132) and an external metal wiring pattern(134). A plurality of tap terminals(140) is formed on the edge of the outer surface of the module printed circuit board. A plurality of mounting pads(150) is electrically connected to the plurality of metal wiring patterns.