| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to simply bond a sub substrate with a semiconductor chip using a WBL(Wafer Backside Lamination) tape to simplify processes, thereby increasing production. CONSTITUTION: A first semiconductor chip(205) has a first bonding pad(207). The first semiconductor chip is attached to a substrate. A first sub substrate(230a) is attached to the first edge part of the first semiconductor chip. A second sub substrate(230b) is attached to the second edge part facing the first edge part. A second semiconductor chip(245) has second bonding pads. The second semiconductor chip is attached onto the first and second sub substrates. An adhesive tape attaches the second semiconductor chip to the first and second sub substrates.
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