| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, easily forming a via and a wiring pattern. SOLUTION: This method includes: a process wherein a surface of a first metal layer where first wiring patterns 113-119 and vias 111 and 112 are formed, is made to face the upper surface of a first insulation layer 100, and a surface of a second metal layer where second wiring patterns 121-127 are formed is made to face the lower surface of the first insulation layer 100; and a process wherein, by pushing in the first wiring patterns 113-119 and the vias 111 and 112 from the upper surface of the first insulation layer 100 and further pushing in the second wiring patterns 121-127 from the lower surface of the first insulation layer 100, the first wiring patterns 113-119 are embedded in the upper part of the first insulation layer 100, and the second wiring patterns 121-127 are embedded in the lower part of the first insulation layer 100, and the vias 111 and 112 are press-bonded to the second wiring patterns 122 and 126. COPYRIGHT: (C)2011,JPO&INPIT |
