| 摘要 |
PROBLEM TO BE SOLVED: To efficiently dissipate heat from rear and side surfaces of a semiconductor chip in a semiconductor device in which the semiconductor chip is flip-chip bonded to a wiring board and a heat sink is mounted to the semiconductor chip. SOLUTION: A heat sink 30 is provided with a through hole 31 penetrating from one surface facing a wiring board 20 to other surface, and a rear surface 12 of a semiconductor chip 10 inserted in the through hole 31 is exposed at an opening on the other surface side of the heat sink 30 in the through hole 31. A side surface 13 of the semiconductor chip 10 is connected to a side surface of the through hole 31 via a solder 80. On the side surface 13 of the semiconductor chip 10, a metal film 70 for securing bonding characteristics with the solder 80 is provided to coat the side surface 13. A connection by the solder 80 is performed via the metal film 70 on the side surface 13. COPYRIGHT: (C)2011,JPO&INPIT |
