| 摘要 |
PROBLEM TO BE SOLVED: To suppress coming-off of a solder paste and ensure a connection reliability between terminals and lands in an electronic device that has a connector having plural kinds of terminals with respectively different cross-sectional shapes, with each terminal soldered to a land on the wall surface of a through-hole. SOLUTION: In the electronic device, the plural kinds of terminals with respectively different cross-sectional shapes that are formed by punching a metal plate with a predetermined thickness and through-holes into which insertion parts of the plural kinds of terminals are to be inserted respectively are formed to satisfy relationships of W1<W2, D1<D2, and W2-W1>D2-D1, in a thickness direction of the metal plate along a direction of the substrate surface and/or in a direction perpendicular to the thickness direction, where W1 and W2 are widths of insertion parts of arbitrary two kinds of terminals, a first terminal and a second terminal, with different cross-sectional shapes, and D1 and D2 are land-inclusive hole diameters of a first through-hole and a second through-hole into which the insertion parts of the first terminal and second terminal are to be inserted. COPYRIGHT: (C)2011,JPO&INPIT
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